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28-526-10
| Manufacturer | Aries Electronics |
|---|---|
| Description | CONN IC DIP SOCKET ZIF 28POS TIN |
| Datasheet |
 Datasheet
|
Product Attributes
| Type | Description |
|---|---|
| Mfr Part Number | 28-526-10 |
| Mfr | Aries Electronics |
| Description | CONN IC DIP SOCKET ZIF 28POS TIN |
| Min Qty | 1 |
| Package | Bulk |
| Series | Lo-PRO®file, 526 |
| Product Status | Active |
| Mounting Type | Through Hole |
| Termination | Solder |
| Features | Closed Frame |
| Type | DIP, ZIF (ZIP) |
| Operating Temperature | -55°C ~ 105°C |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Contact Finish Mating | Tin |
| Pitch Mating | 0.100" (2.54mm) |
| Contact Finish Thickness Mating | 10.0µin (0.25µm) |
| Contact Finish Post | Tin |
| Number Of Positions Or Pins Grid | 28 (2 x 14) |
| Contact Material Mating | Beryllium Copper |
| Pitch Post | 0.100" (2.54mm) |
| Contact Finish Thickness Post | 10.0µin (0.25µm) |
| Contact Material Post | Beryllium Copper |