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20-823-90
| Manufacturer | Aries Electronics |
|---|---|
| Description | CONN IC DIP SOCKET 20POS GOLD |
| Datasheet |
 Datasheet
|
Product Attributes
| Type | Description |
|---|---|
| Mfr Part Number | 20-823-90 |
| Mfr | Aries Electronics |
| Description | CONN IC DIP SOCKET 20POS GOLD |
| Min Qty | 1 |
| Package | Bulk |
| Series | Vertisockets™ 800 |
| Product Status | Active |
| Mounting Type | Through Hole, Right Angle, Horizontal |
| Termination | Solder |
| Features | Closed Frame |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Operating Temperature | - |
| Housing Material | Polyamide (PA46), Nylon 4/6 |
| Contact Finish Mating | Gold |
| Pitch Mating | 0.100" (2.54mm) |
| Contact Finish Thickness Mating | 10.0µin (0.25µm) |
| Contact Finish Post | Gold |
| Number Of Positions Or Pins Grid | 20 (2 x 10) |
| Contact Material Mating | Phosphor Bronze |
| Pitch Post | 0.100" (2.54mm) |
| Contact Finish Thickness Post | 10.0µin (0.25µm) |
| Contact Material Post | Phosphor Bronze |