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12-823-90C
| Manufacturer | Aries Electronics |
|---|---|
| Description | CONN IC DIP SOCKET 12POS GOLD |
| Datasheet |
 Datasheet
|
Product Attributes
| Type | Description |
|---|---|
| Mfr Part Number | 12-823-90C |
| Mfr | Aries Electronics |
| Description | CONN IC DIP SOCKET 12POS GOLD |
| Min Qty | 1 |
| Package | Bulk |
| Series | Vertisockets™ 800 |
| Product Status | Active |
| Mounting Type | Through Hole, Right Angle, Horizontal |
| Termination | Solder |
| Features | Closed Frame |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Operating Temperature | -55°C ~ 105°C |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Contact Finish Mating | Gold |
| Pitch Mating | 0.100" (2.54mm) |
| Contact Finish Thickness Mating | 30.0µin (0.76µm) |
| Contact Finish Post | Tin |
| Number Of Positions Or Pins Grid | 12 (2 x 6) |
| Contact Material Mating | Beryllium Copper |
| Pitch Post | 0.100" (2.54mm) |
| Contact Finish Thickness Post | 200.0µin (5.08µm) |
| Contact Material Post | Brass |