Manufacturer | Analog Devices Inc. |
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Description | 56-BUMP WAFER LEVEL CHIP SCALE P |
Datasheet |
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Type | Description |
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Mfr Part Number | ADAU1860BCBZRL |
Mfr | Analog Devices Inc. |
Description | 56-BUMP WAFER LEVEL CHIP SCALE P |
Min Qty | 1 |
Package | Tape & Reel (TR),Cut Tape (CT) |
Series | - |
Product Status | Active |
Operating Temperature | -40°C ~ 85°C |
Mounting Type | Surface Mount |
Package Case | 56-UFBGA, WLCSP |
Supplier Device Package | 56-WLCSP (2.98x2.68) |
Type | Audio |
Resolution Bits | 24 b |
Data Interface | I²C, I²S, SPI |
Voltage Supply Analog | 1.7V ~ 1.98V |
Voltage Supply Digital | 0.85V ~ 1.21V |
Number Of Adcs Dacs | 3 / 1 |
Sigma Delta | No |
S N Ratio Adcs Dacs Db Typ | - |
Dynamic Range Adcs Dacs Db Typ | 110 / 130 |