Manufacturer Analog Devices Inc.
Description 56-BUMP WAFER LEVEL CHIP SCALE P
Datasheet Datasheet
Product Attributes
Type Description
Mfr Part Number ADAU1860BCBZRL
Mfr Analog Devices Inc.
Description 56-BUMP WAFER LEVEL CHIP SCALE P
Min Qty 1
Package Tape & Reel (TR),Cut Tape (CT)
Series -
Product Status Active
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package Case 56-UFBGA, WLCSP
Supplier Device Package 56-WLCSP (2.98x2.68)
Type Audio
Resolution Bits 24 b
Data Interface I²C, I²S, SPI
Voltage Supply Analog 1.7V ~ 1.98V
Voltage Supply Digital 0.85V ~ 1.21V
Number Of Adcs Dacs 3 / 1
Sigma Delta No
S N Ratio Adcs Dacs Db Typ -
Dynamic Range Adcs Dacs Db Typ 110 / 130
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